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ST Ericsson Semiconductor Backend Test & Assembly Equipment

Private Treaty Assets Immediately Available for Negotiation

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Value
By order of ST Ericsson in conjunction with Maynards and GES Associates.


Following the Split of ST-Ericsson and Due to the Closing-down of the Remaining Operations of ST Ericsson we offer for Immediate Sale ex site and on an Exclusive Basis:

Semiconductor Backend Test & Assembly Equipment, Test & Measurement, Lab, and other surplus assets.

ST Ericsson was manufacturing wireless products and semiconductors since 2009, supplying these to mobile device manufacturers.

Featuring:

Test Equipment

  • (TERADYNE, SPEA, CREDENCE, LTX)
  • Handlers (ADVANTEST, SEIKO-EPSON, MULTITEST, SYNAX, RASCO)
  • Probers (ELECTROGLASS, TEL)
  • Bonders (ASM, ESEC)

Chip Assembly

  • Dicing Saws (DISCO)
  • Singulators (INTERCON and TOWA)
  • Reflow Ovens (BTU, CONCEPTRONIC)
  • Mold (FICO)
  • Plasma Cleaning (UCP, INFICON)
  • Laser Marking (ROFIN)

Location of Assets

  • Shenzhen, PRC
  • Calamba, Philippines
  • Amkor, Philippines
  • Muar, Malaysia
  • Toa Payoh, Singapore
  • Grenoble, France

Detailed equipment specifications including pictures available upon request from qualified buyers.  Please click the following link to the asset list.
http://www.gesemi.com/steEquipment.aspx

For inquiries on Production Equipment, please contact:
Kevin Shows
GES Associates
tel. no: +1 480 610 1604
email:  sales@gesemi.com


Notice to purchasers:
Buyers premium: 16%
VAT/Tax: Subject to country specific taxes
Inspection details: Strictly by appointment
Payment type: Cash, Check, Wire Transfer
Currency: United States Dollars
Sales agent: GoIndustry-DoveBid (H.K.) Ltd.
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Event Information
Location: Various locations worldwide


Contact Details
Contact: Hugh Yu
Telephone: +86 21 6272 6246
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