TEL Clean Track MARK8Z Coater / Developer - SOLD LOT

Description: Tool code PAT25 For configuration sheet Click HEREConfiguration
Process COAT/DEVE
WAFER SPECIFICATION
Wafer Size 200MM
Wafer Shape SNNF (Semi Notch No Flat)
Wafer　Cassette 8” PP Miraial
SYSTEM CONFIGURATION
Process Block 2
Coater head# 2
Develop head# 3
Adhesion Chamber# 2
Hot Plate# 12
High Cooling Plate# 5
WEE# 2
IFB
Chemical Box (HMDS/Solvent/NMDW) 1
Cup T&H Control 1
Carrier Station
Stage 1×4 Side Loading (Sender /Receiver or Uni - cassette)
Coater
Nozzle# 3
Resist temperature Control Multi
Coater Cup PP+PPS with Mist trap
Spin chuck PEEK
Resist Pump F/T200-1 RRC Pump
Back rinse Flow meter Max range 150ml/min with flow sensor
Solvent Bath Flow meter Max range 50ml/min with flow sensor
EBR Flow meter Max range 20ml/min
RRC Nozzle Flow meter Max range 150ml/min
Drain Central
Motor Flange temp control 1
Solvent solution supply Central supply
Developer
Nozzle E Square Nozzle
Develop solution supply Central supply
Developer Cup FR-PP + PPS with Mist trap
Spin chuck PEEK
E Square Nozzle Flow meter Max range 3.0l/min with flow sensor
Rinse Nozzle Flow meter Max range 2.0l/min with flow sensor
Back Rinse Flow meter Max range 150ml/min with flow sensor
Develop temperature control 15-50deg by 0.1deg pitch
Drain Central
Motor Flange temp control 1
Adhesion
Method Vapor prime by N2 bubbling
Hot plate 30-179.9deg by 0.1deg pitch
HMDS solution supply Central supply
Hot Plate
Method Proximity bake with 0.1mm
Hot plate 30-179.9deg by 0.1deg pitch
High Cooling Plate
Method Proximity cooling with 0.1mm
Cooling plate 15-35deg by 0.1deg pitch
Wait on cooling plate On
WEE
Lamp Mercury xenon
Wave length 300-500nm
IFB
Buffer 2
Pick up 1
Cooling plate 1
Note the above information is for guidance only. Changes to configuration might have been made

Quantity: Contact for Availability

Serial number: 826780

Date of manufacture: 1996

Location: Nishiwaki, Japan

Preview inspection: By prior appointment